Texas Instruments CC2564MODN Bluetooth Host Controller Interface (HCI) Module is a complete Bluetooth BR/EDR/LE HCI solution that reduces design effort and enables fast time to market. Based on TI's seventh-generation Bluetooth core, the HCI module provides a product-proven solution that is Bluetooth 4.1 compliant. When coupled with a microcontroller unit (MCU), the HCI module provides best-in-class RF performance. TI's power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR/EDR/LE modes of operation. With transmit power and receive sensitivity, this solution provides a best-in-class range of about 2x, compared to other BLE-only solutions.
Features
- Single-Chip Solution Integrating Bluetooth Basic Rate (BR)/Enhanced Data Rate (EDR)/Low Energy (LE) Features
- Fully Certified Bluetooth 4.1 Module
- Compliant Up to the HCI Layer
- FCC (Z64-2564N)/IC (451I-2564N) Modular Grant with External Chip Antenna
- CE Certified as Summarized in the Declaration of Conformity
- Bluetooth 4.1 Controller Subsystem Qualified (QDID 55257)
- BR/EDR Features Include
- Up to 7 Active Devices
- Scatternet: Up to 3 Piconets Simultaneously, 1 as Master and 2 as Slaves
- Up to 2 SCO Links on the Same Piconet
- Support for All Voice Air-Coding - Continuously Variable Slope Delta (CVSD), A-Law, µ-Law, and Transparent (Uncoded)
- Assisted Mode for HFP 1.6 Wideband Speech (WBS) Profile or A2DP Profile to Reduce Host Processing and Power
- LE Features Include
- Support of Up to 10 Simultaneous Connections
- Multiple Sniff Instances Tightly Coupled to Achieve Minimum Power Consumption
- Independent Buffering for LE Allows Large Numbers of Multiple Connections without Affecting BR/EDR Performance
- Built-In Coexistence and Prioritization Handling for BR/EDR and LE
- Flexibility for Easy Stack Integration and Validation Into Various Microcontrollers, Such as MSP430 and ARM Cortex-M3 and Cortex-M4 MCUs
- Highly Optimized for Design into Small Form Factor Systems
- Single-Ended 50Ω RF Interface
- Module Footprint: 33 Terminals, 0.9mm Pitch, 7mm x 7mm x 1.4mm
- Best-in-Class Bluetooth (RF) Performance (TX Power, RX Sensitivity, Blocking)
- Class 1.5 TX Power Up to +10dBm
- -93dbm Typical RX Sensitivity
- Improved Adaptive Frequency Hopping (AFH) Algorithm with Minimum Adaptation Time
- Provides Longer Range, Including 2x Range Over Other BLE-Only Solutions
- Advanced Power Management for Extended Battery Life and Ease of Design
- On-Chip Power Management, Including Direct Connection to Battery
- Low Power Consumption for Active, Standby, and Scan Bluetooth Modes
- Shutdown and Sleep Modes to Minimize Power Consumption
- Physical Interfaces
- UART Transport Layer with Maximum Rate of 4Mbps
- Three-Wire UART Transport Layer with Maximum Rate of 4Mbps
- Fully Programmable Digital PCM-I2S Codec Interface
- CC256x Bluetooth Hardware Evaluation Tool: PC-Based Application to Evaluate RF Performance of the Device and Configure Service Pack
- Lead-Free Design Compliant with RoHS Requirements
- Built-In CC2564B Single-Chip Bluetooth Device Fully Compliant with Bluetooth and EDR
- Supports Class 1.5 (High-Output Power) Applications
- Small Size with Low Power Consumption
- Supports Maximum Bluetooth Data Rates Over HCI UART Interface
- Supports Multiple Bluetooth Profiles with Enhanced QoS (Mono and Stereo)
- Assisted A2DP (No Host Processing Required)
Applications- Mobile Accessories
- Sports and Fitness Applications
- Wireless Audio Solutions
- Remote Controls
- Toys
